., A. S. M. (2011). Development of nanocomposites heat sink (MWCNTs/Cu) using powder injection moulding for electronic applications.
Chicago Style Citation., Ali S Muhsan. Development of Nanocomposites Heat Sink (MWCNTs/Cu) Using Powder Injection Moulding for Electronic Applications. 2011.
MLA Citation., Ali S Muhsan. Development of Nanocomposites Heat Sink (MWCNTs/Cu) Using Powder Injection Moulding for Electronic Applications. 2011.
Warning: These citations may not always be 100% accurate.