APA Citation

Hoe, H. (2019). An Integrated Model for Adjustment of Process Parameters to Recover Throughput Shortage in Semiconductor Assembly: A Case Study. Universitat Politecnica de Catalunya.

Chicago Style Citation

Hoe, H.K. An Integrated Model for Adjustment of Process Parameters to Recover Throughput Shortage in Semiconductor Assembly: A Case Study. Universitat Politecnica de Catalunya, 2019.

MLA Citation

Hoe, H.K. An Integrated Model for Adjustment of Process Parameters to Recover Throughput Shortage in Semiconductor Assembly: A Case Study. Universitat Politecnica de Catalunya, 2019.

Warning: These citations may not always be 100% accurate.