APA Citation

Chandrakasan, G. (2016). Investigation on thermocompression bonding using lead free sinterable paste and high lead solder paste for high power led packaging. Asian Research Publishing Network.

Chicago Style Citation

Chandrakasan, G. Investigation On Thermocompression Bonding Using Lead Free Sinterable Paste and High Lead Solder Paste for High Power Led Packaging. Asian Research Publishing Network, 2016.

MLA Citation

Chandrakasan, G. Investigation On Thermocompression Bonding Using Lead Free Sinterable Paste and High Lead Solder Paste for High Power Led Packaging. Asian Research Publishing Network, 2016.

Warning: These citations may not always be 100% accurate.