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Applications of electron back-scatter diffraction to texture research /
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Advanced neutron radiography inspection in industrial applications /
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The comparison of neutron, gamma and x-ray radiography images for materials evaluation /
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Mechanical characterisation of surface layers by x-ray diffraction - application to tribology /
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Small-angle neutron scattering instrument at MINT /
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Application of X-ray diffraction techniques to the understanding of the dry sliding wear behaviour of aluminum and titanium /
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Residual stress characterization of welds using x-ray diffraction techniques /
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Determination of molecular packing in langmuir-blodgett films by x-ray diffraction /
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Non-destructive evaluation of the integrity of venturi scrubber using neutron backscatter technique /
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A study on the phase transfornation of MgO-P205 glass by x-ray diffraction /
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Electronic speckle pattern shearing interferometry application in material evaluation /
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Quantitative phase analysis in industrial research /
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Radar application in void and bar detection /
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Videoscope applications in oil and gas industries /
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Effective applications of auger electron spectroscopy /
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Application of corrosion screening tools for riser inspection /
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XRF, XRD and SEM facilities in the school of materials and mineral resources engineering, Universiti Sains Malaysia /
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Application of energy-dispersive XRF technique in the hydrometallurgy study of local zircon /
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The application of sem in analysing the damage to the petroleum reservoirs caused by drilling fluids /
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Application of X-ray method for measuring internal stress in the gear teeth surface layer /
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PROCEEDING International Conference on X-Rays & Related Techniques in Research & Industry (ICXRI2010) : -Strengthening Network in X-Ray- Aseania Resort Langkawi, Kedah, Malaysia 9 – 10 June 2010 /
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Proceedings Asian Conference on X-Rays and Related Techniques in Research and Industry (ACXRI '96), 6-8 June 1996, held at Casuarina Hotel, Ipoh, Malaysia
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Microstructure investigations of Ba-Sr mixed ferrites, using sem technique /
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Thermosonic wire bonding of IC devices using palladium wire /