主题: Electrical engineering
- Analysis of Bonding Failure in CMOS MEMS Chips /
- A cross-layer approach for reliable communication in wireless body area networks /
- Visual Surveillance with Risk Map : Symposium Progress Report – January 2015 Intelligent Signal and Imaging /
- Environmentally assisted reliability study of externally actuated MEMS devices /
- Bio-inspired Network on Chip Fault Tolerant Technique using QoS / Muhammad Athar Javed Sethi, Fawnizu Azmadi Hussin, Nor Hisham Hamid
- Oscillation Based Testing Methodology for MEDA Based Digital Microfluidics Biochips /
主题: Electronic engineering
作者: Fawnizu Azmadi Hussin
作者: Altahir, Abdalla Altahir
相似书籍: Analysis of Bonding Failure in CMOS MEMS Chips /
- Design and Simulation of CMOS MEMS Magnetic sensor and Low Noise Amplifier using 0.35um technology /
- Development of CMOS-MEMS Biosensor for Detection of Inflammatory Lung Diseases via Deermining the Concentration of Hydrogen Peroxide Vapor in Exhaled Breath /
- Post CMOS Processing of Resonant Magnetic Field Sensor /
- Finite Element Analysis of a Mass-Sensitive CMOS-MEMS Resonator using Conventor Ware Simulation Software /
- Static Characterization of CMOS-MEMS Device for Acetone Vapor Detection in Exhaled Breath /
- Environmentally assisted reliability study of externally actuated MEMS devices /
相似书籍: A cross-layer approach for reliable communication in wireless body area networks /
- Wireless networks : Multiuser detection in cross-layer design /
- Elimination of audio buzzing in a wireless communication device /
- Adaptation and cross layer design in wireless networks /
- Wireless personal and local area networks /
- Wireless local area networks : technology, issues and strategies
- Solder joint reliability of flip chip BGA package /