Experimental Preparation and Numerical Simulation of High Thermal Conductive Cu/CNTs Nanocomposites

Due to the rapid growth of high performance electronics devices accompanied by overheating problem, heat dissipater nanocomposites material having ultra-high thermal conductivity and low coefficient of thermal expansion was proposed. In this work, a nanocomposite material made of copper (Cu) reinfor...

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Main Author:	., Ali Samer Muhsan, Faiz Ahmad, Norani M Mohamed, Puteri Sri Melor
Format:	Article
Institution:	Universiti Teknologi Petronas
Record Id / ISBN-0:	utp-eprints.12130 /
Published:	2014
Subjects:	T Technology (General)
Online Access:	http://www.matec-conferences.org/articles/matecconf/abs/2014/04/matecconf_icper2014_04028/matecconf_icper2014_04028.html http://eprints.utp.edu.my/12130/
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