Phase change material/heat pipe and Copper foam-based heat sinks for thermal management of electronic systems
Phase change material (PCM) has been extensively used for their thermal management but due to low conductivity that hinders the performance of a system. Since heat pipe and porous materials both have high thermal conductivities, they can be used to form hybrid system with PCM which significantly enh...
| Main Authors: | Hayat, M.A., Ali, H.M., Janjua, M.M., Pao, W., Li, C., Alizadeh, M. |
|---|---|
| Format: | Article |
| Institution: | Universiti Teknologi Petronas |
| Record Id / ISBN-0: | utp-eprints.23433 / |
| Published: |
Elsevier Ltd
2020
|
| Online Access: |
https://www.scopus.com/inward/record.uri?eid=2-s2.0-85092713427&doi=10.1016%2fj.est.2020.101971&partnerID=40&md5=7e65ca449b72e228ee7e8552f302d6f7 http://eprints.utp.edu.my/23433/ |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|