A review of graphene reinforced Cu matrix composites for thermal management of smart electronics
Heat dissipation remains a key challenge to be addressed, determining the performance and durability of smart electronic devices. Graphene reinforced metal matrix composites have been extensively studied as a thermal management material due to their high thermal conductivity and low coefficient of t...
| Main Authors: | Ali, S., Ahmad, F., Yusoff, P.S.M.M., Muhamad, N., Oñate, E., Raza, M.R., Malik, K. |
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| Format: | Article |
| Institution: | Universiti Teknologi Petronas |
| Record Id / ISBN-0: | utp-eprints.23878 / |
| Published: |
Elsevier Ltd
2021
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| Online Access: |
https://www.scopus.com/inward/record.uri?eid=2-s2.0-85101896828&doi=10.1016%2fj.compositesa.2021.106357&partnerID=40&md5=ea63a56ddaceb66c9d5630e12b743cca http://eprints.utp.edu.my/23878/ |
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