Expeditious Fabrication Characterization of Metal Interdigitated Transducer on Polyimide film for Biosensing Application

Interdigitated electrode (IDE) as transducer in biosensor usually fabricated through tedious, time consuming photolithography technique by using rigid substrate such as silicon and glass. The material type and geometry of the IDE is one of the important factor for an enhanced sensitivity of the devi...

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Main Authors: Subramani, I.G., Bin Ahmad Fauzi, I.A., Perumal, V.
Format: Conference or Workshop Item
Institution: Universiti Teknologi Petronas
Record Id / ISBN-0: utp-eprints.24909 /
Published: Institute of Electrical and Electronics Engineers Inc. 2019
Online Access: https://www.scopus.com/inward/record.uri?eid=2-s2.0-85075632895&doi=10.1109%2fSCORED.2019.8896299&partnerID=40&md5=c6ec7b591d0408764b10e71a92b3c059
http://eprints.utp.edu.my/24909/
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spelling utp-eprints.249092021-08-27T06:37:56Z Expeditious Fabrication Characterization of Metal Interdigitated Transducer on Polyimide film for Biosensing Application Subramani, I.G. Bin Ahmad Fauzi, I.A. Perumal, V. Interdigitated electrode (IDE) as transducer in biosensor usually fabricated through tedious, time consuming photolithography technique by using rigid substrate such as silicon and glass. The material type and geometry of the IDE is one of the important factor for an enhanced sensitivity of the device. Flexible substrate, polyimide have been employed as alternatives to fabricate more sensitive, cheaper and robust small devices. In this paper, silver (Ag) and copper (Cu) IDEs was fabricated on polyimide substrate via one step radio frequency sputtering technique by transferring the pattern of IDE from Perspex hard mask onto polyimide substrate. Design of the IDE was drawn using AutoCAD 2018 software with appropriate geometry and Perspex hard mask was cut through laser cutting technique. IDE with two different surface area, circle shaped and square shaped was fabricated for each material type (silver and copper). High power microscope (HPM) was used to verify the dimensions of the fabricated IDE and to investigate optimum sputtering time. Voltage analysis demonstrate that Ag based circular shaped IDE with 0.8 mm gap dimension resulted 1.15 � 10-2 V, greater electrical behavior compares to copper based IDE. © 2019 IEEE. Institute of Electrical and Electronics Engineers Inc. 2019 Conference or Workshop Item NonPeerReviewed https://www.scopus.com/inward/record.uri?eid=2-s2.0-85075632895&doi=10.1109%2fSCORED.2019.8896299&partnerID=40&md5=c6ec7b591d0408764b10e71a92b3c059 Subramani, I.G. and Bin Ahmad Fauzi, I.A. and Perumal, V. (2019) Expeditious Fabrication Characterization of Metal Interdigitated Transducer on Polyimide film for Biosensing Application. In: UNSPECIFIED. http://eprints.utp.edu.my/24909/
institution Universiti Teknologi Petronas
collection UTP Institutional Repository
description Interdigitated electrode (IDE) as transducer in biosensor usually fabricated through tedious, time consuming photolithography technique by using rigid substrate such as silicon and glass. The material type and geometry of the IDE is one of the important factor for an enhanced sensitivity of the device. Flexible substrate, polyimide have been employed as alternatives to fabricate more sensitive, cheaper and robust small devices. In this paper, silver (Ag) and copper (Cu) IDEs was fabricated on polyimide substrate via one step radio frequency sputtering technique by transferring the pattern of IDE from Perspex hard mask onto polyimide substrate. Design of the IDE was drawn using AutoCAD 2018 software with appropriate geometry and Perspex hard mask was cut through laser cutting technique. IDE with two different surface area, circle shaped and square shaped was fabricated for each material type (silver and copper). High power microscope (HPM) was used to verify the dimensions of the fabricated IDE and to investigate optimum sputtering time. Voltage analysis demonstrate that Ag based circular shaped IDE with 0.8 mm gap dimension resulted 1.15 � 10-2 V, greater electrical behavior compares to copper based IDE. © 2019 IEEE.
format Conference or Workshop Item
author Subramani, I.G.
Bin Ahmad Fauzi, I.A.
Perumal, V.
spellingShingle Subramani, I.G.
Bin Ahmad Fauzi, I.A.
Perumal, V.
Expeditious Fabrication Characterization of Metal Interdigitated Transducer on Polyimide film for Biosensing Application
author_sort Subramani, I.G.
title Expeditious Fabrication Characterization of Metal Interdigitated Transducer on Polyimide film for Biosensing Application
title_short Expeditious Fabrication Characterization of Metal Interdigitated Transducer on Polyimide film for Biosensing Application
title_full Expeditious Fabrication Characterization of Metal Interdigitated Transducer on Polyimide film for Biosensing Application
title_fullStr Expeditious Fabrication Characterization of Metal Interdigitated Transducer on Polyimide film for Biosensing Application
title_full_unstemmed Expeditious Fabrication Characterization of Metal Interdigitated Transducer on Polyimide film for Biosensing Application
title_sort expeditious fabrication characterization of metal interdigitated transducer on polyimide film for biosensing application
publisher Institute of Electrical and Electronics Engineers Inc.
publishDate 2019
url https://www.scopus.com/inward/record.uri?eid=2-s2.0-85075632895&doi=10.1109%2fSCORED.2019.8896299&partnerID=40&md5=c6ec7b591d0408764b10e71a92b3c059
http://eprints.utp.edu.my/24909/
_version_ 1741196888364810240
score 11.62408

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