Convective Cooling Enhancement in Electronic Systems by Using Vibration

Electronics and heat have been linked due to the high demand. Every heat sink generates a specific temperature which yields to the generation of a thermal boundary layer profile that when disturbed; would allow for higher rates of heat dissipation. Inorder, to make this project feasible, a specif...

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Main Author: ABDALLA EBRAHEEM, AMMAR FAISAL
Format: Final Year Project
Language: English
Institution: Universiti Teknologi Petronas
Record Id / ISBN-0: utp-utpedia.19288 /
Published: 2018
Online Access: http://utpedia.utp.edu.my/19288/1/FYP-Dissertation.pdf
http://utpedia.utp.edu.my/19288/
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spelling utp-utpedia.192882019-06-11T10:28:38Z http://utpedia.utp.edu.my/19288/ Convective Cooling Enhancement in Electronic Systems by Using Vibration ABDALLA EBRAHEEM, AMMAR FAISAL Electronics and heat have been linked due to the high demand. Every heat sink generates a specific temperature which yields to the generation of a thermal boundary layer profile that when disturbed; would allow for higher rates of heat dissipation. Inorder, to make this project feasible, a specific electronic device had to be selected and, in this case, it is a computer. Computers are the focus of this era since it can perform a higher level of data processing than a laptop. The selected computer model is Intel Xeon E5-2650 v3 2.3GHz which commonly used in the university. The heat sink’s (processor) area has been enlarged by the addition fins onto it, there is enough space inside the computer to allow for this. The purpose of the numerical simulation is to investigate the ideology of heat dissipation when the surface area is enlarged and since computers vibrate due to the cooling fan, that vibration is going to be induced to the enlarged heat sink as part of the simulation. Consequently, the enhancement that has occurred for both cases of the processor before and after the enlargement of the area are going to be compared and studied with the vibration induced at different amplitudes. Moreover, varying the amplitude of vibration to evaluate with would yield to enhanced heat dissipation is the main objective of this investigation. Finally, vibration has proved to enhance the heat transfer further than with only the surface area enlarged. 2018-01 Final Year Project NonPeerReviewed application/pdf en http://utpedia.utp.edu.my/19288/1/FYP-Dissertation.pdf ABDALLA EBRAHEEM, AMMAR FAISAL (2018) Convective Cooling Enhancement in Electronic Systems by Using Vibration. UNSPECIFIED.
institution Universiti Teknologi Petronas
collection UTPedia
language English
description Electronics and heat have been linked due to the high demand. Every heat sink generates a specific temperature which yields to the generation of a thermal boundary layer profile that when disturbed; would allow for higher rates of heat dissipation. Inorder, to make this project feasible, a specific electronic device had to be selected and, in this case, it is a computer. Computers are the focus of this era since it can perform a higher level of data processing than a laptop. The selected computer model is Intel Xeon E5-2650 v3 2.3GHz which commonly used in the university. The heat sink’s (processor) area has been enlarged by the addition fins onto it, there is enough space inside the computer to allow for this. The purpose of the numerical simulation is to investigate the ideology of heat dissipation when the surface area is enlarged and since computers vibrate due to the cooling fan, that vibration is going to be induced to the enlarged heat sink as part of the simulation. Consequently, the enhancement that has occurred for both cases of the processor before and after the enlargement of the area are going to be compared and studied with the vibration induced at different amplitudes. Moreover, varying the amplitude of vibration to evaluate with would yield to enhanced heat dissipation is the main objective of this investigation. Finally, vibration has proved to enhance the heat transfer further than with only the surface area enlarged.
format Final Year Project
author ABDALLA EBRAHEEM, AMMAR FAISAL
spellingShingle ABDALLA EBRAHEEM, AMMAR FAISAL
Convective Cooling Enhancement in Electronic Systems by Using Vibration
author_sort ABDALLA EBRAHEEM, AMMAR FAISAL
title Convective Cooling Enhancement in Electronic Systems by Using Vibration
title_short Convective Cooling Enhancement in Electronic Systems by Using Vibration
title_full Convective Cooling Enhancement in Electronic Systems by Using Vibration
title_fullStr Convective Cooling Enhancement in Electronic Systems by Using Vibration
title_full_unstemmed Convective Cooling Enhancement in Electronic Systems by Using Vibration
title_sort convective cooling enhancement in electronic systems by using vibration
publishDate 2018
url http://utpedia.utp.edu.my/19288/1/FYP-Dissertation.pdf
http://utpedia.utp.edu.my/19288/
_version_ 1741195474692472832
score 11.62408

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