Thermal Analysis of Semiconductor: Peak Junction Temperature Prediction
Semiconductor industries become really important towards today’s technology. Integrated Circuit (IC) are produced to meet the demand since there are lots of modern devices nowadays rely on this semiconductor devices. Due to this scenario, most ICs are designed to operate with high power dissipati...
| Main Author: | Hussin, Nur Ain Nabilah |
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| Format: | Final Year Project |
| Language: | English |
| Institution: | Universiti Teknologi Petronas |
| Record Id / ISBN-0: | utp-utpedia.22566 / |
| Published: |
Universiti Teknologi PETRONAS
2016
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| Subjects: | |
| Online Access: |
http://utpedia.utp.edu.my/22566/1/FinalDissertation.pdf http://utpedia.utp.edu.my/22566/ |
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| Summary: |
Semiconductor industries become really important towards today’s technology.
Integrated Circuit (IC) are produced to meet the demand since there are lots of modern
devices nowadays rely on this semiconductor devices. Due to this scenario, most ICs are
designed to operate with high power dissipation and speed together with greater
packaging density. This features will lead to the increasing of operating temperature as
well as decrease the reliability and performance of the system. Besides, the performance
of the devices also might be degrade or even fail to function properly. Therefore to
overcome this problem, thermal analysis need to be carried out in order to determine the
thermal profile of the system and to predict the peak junction temperature. So that, an
appropriate cooling strategy and temperature monitoring system can be implemented to
provide a controlled temperature surface to an electronic component. |
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