The metallurgical approach on the solder voids behaviour in surface mount devices /

مواد مشابهة

• Radar application in void and bar detection /
  حسب: Amry Amin Abas
• Thermosonic wire bonding of IC devices using palladium wire /
  حسب: Shze, J. Hu
• Mechanical characterisation of surface layers by x-ray diffraction - application to tribology /
  حسب: Farrahi, G.H
• Application of X-ray method for measuring internal stress in the gear teeth surface layer /
  حسب: Zaborowski, Tadeusz
• Application of X-ray diffraction techniques to the understanding of the dry sliding wear behaviour of aluminum and titanium /
  حسب: Farhat, Zoheir N.