记录引文
APA引文
Shze, J. H., M.T. Poh, & R.M. Tan. Thermosonic wire bonding of IC devices using palladium wire.
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芝加哥风格引文
Shze, J. Hu, M.T. Poh, 与 R.M. Tan. Thermosonic Wire Bonding of IC Devices Using Palladium Wire.
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MLA引文
Shze, J. Hu, et al. Thermosonic Wire Bonding of IC Devices Using Palladium Wire.
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警告：这些引文格式不一定是100％准确.