Development of nanocomposites heat sink (MWCNTs/Cu) using powder injection moulding for electronic applications

A fabrication of high performance heat sink composite material made of copper matrix reinforced by multiwalled carbon nanotubes (MWCNTs) up to 2.5 Vol.% using powder injection molding technique (PIM) has been done successfully. A mixture of Cu/MWCNTs was compounded using a Z-blade mixer for homog...

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Main Author: ., Ali S Muhsan, Faiz Ahmad
Format: Article
Institution: Universiti Teknologi Petronas
Record Id / ISBN-0: utp-eprints.12121 /
Published: 2011
Subjects:
T Technology (General)
Online Access: http://ieeexplore.ieee.org/abstract/document/6136407/
http://eprints.utp.edu.my/12121/
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spelling utp-eprints.121212017-04-06T02:33:03Z Development of nanocomposites heat sink (MWCNTs/Cu) using powder injection moulding for electronic applications ., Ali S Muhsan, Faiz Ahmad T Technology (General) A fabrication of high performance heat sink composite material made of copper matrix reinforced by multiwalled carbon nanotubes (MWCNTs) up to 2.5 Vol.% using powder injection molding technique (PIM) has been done successfully. A mixture of Cu/MWCNTs was compounded using a Z-blade mixer for homogenous dispersion of solids in the binder. The flow properties were measured using a capillary rheometer in the shear rate range which expected to occur during metal injection molding. 2011-09 Article PeerReviewed http://ieeexplore.ieee.org/abstract/document/6136407/ ., Ali S Muhsan, Faiz Ahmad (2011) Development of nanocomposites heat sink (MWCNTs/Cu) using powder injection moulding for electronic applications. Development of nanocomposites heat sink (MWCNTs/Cu) using powder injection moulding for electronic applications . (Submitted) http://eprints.utp.edu.my/12121/
institution Universiti Teknologi Petronas
collection UTP Institutional Repository
topic T Technology (General)
spellingShingle T Technology (General)
., Ali S Muhsan, Faiz Ahmad
Development of nanocomposites heat sink (MWCNTs/Cu) using powder injection moulding for electronic applications
description A fabrication of high performance heat sink composite material made of copper matrix reinforced by multiwalled carbon nanotubes (MWCNTs) up to 2.5 Vol.% using powder injection molding technique (PIM) has been done successfully. A mixture of Cu/MWCNTs was compounded using a Z-blade mixer for homogenous dispersion of solids in the binder. The flow properties were measured using a capillary rheometer in the shear rate range which expected to occur during metal injection molding.
format Article
author ., Ali S Muhsan, Faiz Ahmad
author_sort ., Ali S Muhsan, Faiz Ahmad
title Development of nanocomposites heat sink (MWCNTs/Cu) using powder injection moulding for electronic applications
title_short Development of nanocomposites heat sink (MWCNTs/Cu) using powder injection moulding for electronic applications
title_full Development of nanocomposites heat sink (MWCNTs/Cu) using powder injection moulding for electronic applications
title_fullStr Development of nanocomposites heat sink (MWCNTs/Cu) using powder injection moulding for electronic applications
title_full_unstemmed Development of nanocomposites heat sink (MWCNTs/Cu) using powder injection moulding for electronic applications
title_sort development of nanocomposites heat sink (mwcnts/cu) using powder injection moulding for electronic applications
publishDate 2011
url http://ieeexplore.ieee.org/abstract/document/6136407/
http://eprints.utp.edu.my/12121/
_version_ 1741196145314496512
score 11.62408

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