Investigation on thermocompression bonding using lead free sinterable paste and high lead solder paste for high power led packaging
Persistently growing High-power LED packaging is used in various flux applications especially microelectronics, aerospace, oil and gas as well. Thermo-compression die-attach layer is perceived to be the most critical element in highpower LED packages as the increase in operating temperature requires...
| Main Authors: | Chandrakasan, G., Ovinis, M. |
|---|---|
| Format: | Article |
| Institution: | Universiti Teknologi Petronas |
| Record Id / ISBN-0: | utp-eprints.25331 / |
| Published: |
Asian Research Publishing Network
2016
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| Online Access: |
https://www.scopus.com/inward/record.uri?eid=2-s2.0-85009186301&partnerID=40&md5=09c07e50122f2c8018629783b9b6963b http://eprints.utp.edu.my/25331/ |
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