Record Citations
APA (7th ed.) Citation
Shze, J. H., M.T. Poh, & R.M. Tan. Thermosonic wire bonding of IC devices using palladium wire.
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Chicago Style (17th ed.) Citation
Shze, J. Hu, M.T. Poh, and R.M. Tan. Thermosonic Wire Bonding of IC Devices Using Palladium Wire.
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MLA (9th ed.) Citation
Shze, J. Hu, et al. Thermosonic Wire Bonding of IC Devices Using Palladium Wire.
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Warning: These citations may not always be 100% accurate.