Analysis of Bonding Failure in CMOS MEMS Chips /

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书目详细资料
Main Authors:	Dennis, John Ojur (Author), Farooq Ahmad (Author), M. Haris Md Khir (Author), Nor Hisham Hamid (Author)
格式:	文件
语言:	英语
主题:	Electrical engineering > Congresses Electronic engineering > Congresses
标签:	添加标签没有标签, 成为第一个标记此记录!

实物特征
参考书目:	Bibliography: page [5]
ISBN:	9789832271901

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