Analysis of Bonding Failure in CMOS MEMS Chips /

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Bibliographic Details
Main Authors:	Dennis, John Ojur (Author), Farooq Ahmad (Author), M. Haris Md Khir (Author), Nor Hisham Hamid (Author)
Format:	Article
Language:	English
Subjects:	Electrical engineering > Congresses Electronic engineering > Congresses
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245	1	0	\|a Analysis of Bonding Failure in CMOS MEMS Chips / \|c John Ojur Dennis, Farooq Ahmad, M. Haris Md Khir, Nor Hisham B Hamid
504			\|a Bibliography: page [5]
650	1	0	\|a Electrical engineering \|v Congresses
650	2	0	\|a Electronic engineering \|v Congresses
700	0		\|a Farooq Ahmad, \|e author.
700	0		\|a M. Haris Md Khir, \|e author.
700	0		\|a Nor Hisham Hamid, \|e author.
773	0		\|7 m2am \|w (PNM)000747347 \|a Postgraduate Symposium Department of Electrical and Electronic Engineering (2012 : Perak) \|t POSTGRADUATE SYMPOSIUM Department of Electrical & Electronic Engineering : Semester : September 2012 / \|z 9789832271901 \|g pages [1]-[5]
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