Thermosonic wire bonding of IC devices using palladium wire /

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Bibliographic Details
Main Author:	Shze, J. Hu
Other Authors:	M.T. Poh, R.M. Tan
Format:	Article
Language:	English
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245	1		\|a Thermosonic wire bonding of IC devices using palladium wire / \|c Shze J. Hu, M.T. Poh & R.M. Tan
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773			\|7 m2am \|w (PNM)000228910 \|a Asian Conference on X-Rays and Related Techniques in Research and Industry (ACXRI'96) ( 1996 : Ipoh, Perak) \|d Tronoh, Perak :; Pusat Pengajian Kejuruteraan Bahan & Sumber Mineral, Universiti Sains Malaysia,; 1996 \|t PROCEEDINGS ASIAN CONFERENCE ON X-RAYS AND RELATED TECHNIQUES IN RESEARCH AND INDUSTRY (ACXRI '96), 6-8 June 1996, held at Casuarina Hotel, Ipoh, Malaysia \|z 9839700405 (pbk.) : \|g p. 197-204
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